Helios Nanolab 600 FEI


FEI Helios NanoLab 600 DualBeam FIB/SEM (Room 102MB)

Dual Beam FIBs are a type of instrumentation that consist of a high-resolution SEM column with a fine-probe ion source (Focused Ion Beam). The Helios NanoLab™ 600 is equipped with a high resolution Elstar™ electron column with a Field Emission Gun (FEG) electron source.  It is capable of imaging with a resolution better than 1 nm @ 15 kV and 2.5 nm at 1 kV beam energies.  The Gallium ion beam (Tomahawk™ ion column) can image and remove material down to 5nm resolution levels. This instrument is capable of preparing S/TEM specimens from specific areas of a sample as well as nano-machining and 3-D imaging.  Adding to the imaging and sputtering capabilities are a SDD XEDS detector and an electron backscatter diffraction detector for orientation imaging. Also available is an OmniProbe AutoProbe™ 200 in-situ sample lift-out system allowing for the preparation of site specific TEM samples without the need for support films.

You can see more specifications of the system below.

FEI Helios Nanolab 600

 Elstar UHR immersion lens FESEM column

 Accelerating voltage range: 350 V – 30 kV

 Beam deceleration with stage bias from -50 V to -4 kV

 Landing voltage range 20 V – 30 kV

 Probe current range: 0.7 pA to 22 nA

 Electron beam resolution at optimum WD

 0.8 nm at 30 kV (STEM)

 0.9 nm at 15 kV

 1.4 nm at 1 kV

 Electron beam resolution at coincident point

 0.9 nm at 15 kV

 1.6 nm at 5 kV

 2.5 nm at 1 kV

 Tomahawk ion column

 Accelerating voltage range: 0.5 – 30 kV

 Probe current range: 0.1 pA – 65 nA with 15 apertures

 Time-of-flight (TOF) correction

 Ion beam resolution at coincident point

 4.0 nm at 30 kV using preferred statistical method

 2.5 nm at 30 kV using selective edge method

 High precision 5-axes motorized stage

 XY: 150 mm, piezo-driven

 Z: 10 mm, motorized

 T: -10º – 60º

 R: n x 360º (endless), piezo-driven

 Tilt accuracy (between 50º to 54º): 0.1º

 X, Y repeatability: 1.0 µm


 Elstar in-lens SE detector (TLD-SE)

 Elstar in-lens BSE detector (TLD-BSE)

 Everhart-Thornley SE detector (ETD)

 IR camera for viewing sample/column

 High performance Ion Conversion and Electron (ICE) detector for secondary ions (SI) and electrons (SE)

 Retractable STEM detector with BF/DF/HAADF segments


 4mm E- and I-beam coincidence point at analytical WD

 Angle between electron and ion columns: 52º

 Maximum sample size: 150 mm diameter with full rotation

 Maximum clearance between stage and coincidence point: 55 mm

 Sample Weight: maximum 500 g (including the sample holder)

 Image processor

 Dwell time range from 0.025 to 25,000 µs/pixel

 up to 6144 x 4096 pixels

 SmartSCAN (256 frame average or integration, line integration and averaging, interlaced scanning) and DCFI (Drift Compensated Frame Integration)

 Supporting software

 "Beam per quad" graphical user interface concept, with up to 4 simultaneously active quads

 FEI SPI, iSPI, iRTM and FIB immersion mode for advanced, real-time SEM And FIB process monitoring and endpointing

 Patterns supported: lines, rectangles, polygons, circles, annuli, cross-sections, and cleaning cross-sections

 Image registration

 Directly imported BMP file or streamfile for 3D milling and deposition

 Material file support for "minimum loop time", beam tuning and independent overlaps


 Gas Injection Systems

 Platinum deposition
 Carbon deposition

 Omniprobe AutoProbe 200 in situ sample lift-out system

 FIB Charge Neutralizer


 macro and script-based DualBeam automation


 automatic acquisition of large images and correlative work


 automated TEM sample preparation with sectioning

 GDStoDB and NanoBuilder

 basic and advanced FEI proprietary CAD-based (GDSII) solutions for FIB and beam deposition optimized nanoprototyping of complex structures

 AutoSlice and View

 automated sequential mill and view to collect series of slice images for 3D reconstruction